Rigid-Flex
·
Mil-P-50884 Type 4
·
Two or more conductive layers with either flexible or
rigid insulating material as insulators between
each one; outer layers may have covers
or exposed pads.
·
Rigid-flex is differentiated from
multilayer circuits with
stiffeners by having
conductors on the rigid
layers. Plated
through-holes extend
through both rigid and
flexible layers (with the
exception of blind and
buried vias).
Rigid-flex also
costs more.
·
Access holes or exposed pads without covers may be
on either or both sides; vias or interconnects can be
fully covered for maximum insulation.
·
Stiffeners, pins, connectors, components, heat sinks,
and mounting brackets are optional.
·
We also manufacture `flush' rigid-flex, where the top
surface of contact areas is level with adjacent
adhesive/insulation.
·
Minco is capable of sequentially laminated, drilled,
and plated circuits, which allows for more flexibility in
designing the circuit.
Note: The Special Considerations for Rigid-Flex section
on page 20 provides additional information for
designing a rigid-flex circuit.
Multilayer, no plated
through-holes
·
MIL-P-50884 Type 5
·
Two or more conductive layers with insulating layers
between each one; outer layers may have covers or
exposed pads.
·
Through-holes are not plated.
·
Access holes or exposed pads without covers may be
on either or both sides.
·
Stiffeners, pins, and connectors are optional.
Polyimide Cover
Polyimide
Substrate
Copper Pad
Copper-Plated Through-Hole
Adhesive
Polyimide Cover
Polyimide
Substrate
Rigid Material
Access Hole
Polyimide Cover
Adhesive
Copper Pad (Layer #1)
Copper Pad (Layer #2)
Polyimide Cover
Polyimide
Substrate
*Adhesiveless base material also available
Application Aid #24
Tel: (763) 571-3121 K Fax: (763) 571-0927 K www.minco.com
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