Engineering Specification
ES-3U5T-1B257-AA
EMC Design Guide for Printed Circuit Boards
Frame 47 of 78
Rev. A
10/01/2002
Printed copies are uncontrolled
4.2. EMC Test Recommendations
It is recommended that all applicable integrated circuits be subjected to radiated
emissions testing according to procedures specified in International Standard IEC-61967*
- "Integrated Circuits, Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz".
The suppliers are encouraged to obtain test reports from IC manufacturers following the
testing to establish a quantitative measure of RF emissions from ICs. The test reports
should contain all salient information and parameters of the tests and test results. The
reports should include test data, test set up description, photograph or sketch of the set up,
software operating modes, and a summary of test results.
The recommended frequency range is 150 kHz 1 GHz, but this may be extended if the
specific procedure is usable over an extended frequency range.
4.3. Test Procedure Applicability
The following criteria may be used to determine if a part is a candidate for RE testing:
·
Digital technology, LSI, products with oscillators or any technology which
has the potential of producing radiated emissions capable of interfering with
communication receiver devices. Examples include microprocessors, high
speed digital ICs, FETs incorporating charge pumps, devices with watchdogs,
switch mode regulator control and driver IC's
·
For all new, re-qualified or existing IC's that have undergone revisions from
previous versions
Examples of factors that would be expected to affect emissions are changes in the
components:
·
Clock drive (internal or external)
·
I/O drive
·
Manufacturing process or material composition that reduces rise/fall time
·
Minimum feature size (die shrink)
·
Package or pinout configuration
·
Lead-frame material