Engineering Specification
ES-3U5T-1B257-AA
EMC Design Guide for Printed Circuit Boards
Frame 49 of 78
Rev. A
10/01/2002
Printed copies are uncontrolled
The following rating system was developed to help classify IC emissions:
Table 41. Rating Levels for IC's
Classification
Description
1
RE
Reference Level 1
2
Reference Level 1
RE
Reference Level 2
3
Reference Level 2
RE
Reference Level 3
4
Reference level 3
RE
Reference Level 4
NR Not
Recommended
RE
Reference Level 4
4.4.1. Level 1
No EMC RE risk. Full EMC RE compliance may be achieved with minimum effort.
Greatest flexibility in EMC design application. Potential cost reduction opportunity
through reduction of:
·
Number of components on PCB
·
Material cost (single-sided PCB opportunity)
·
PCB design iterations
·
Testing cycles
·
PCB assembly time
4.4.2. Level 2
Minor EMC RE risk. Less flexibility in EMC design than Level 1 but full
compliance may still be achieved with little effort. Additional components and/or
stricter adherence to industry's fundamental EMC design practices may be required.
4.4.3. Level 3
Moderate EMC RE risk. Close follow up of EMC fundamental design principles is
strongly recommended. Additional preventive measures may be required, and may
include the introduction of T-filters, Pi-filters, ferrites, inductors, etc. Extra PCB
layers, components, and/or component shielding may also be necessary.
Summary :
Rating Levels for IC's Classification Description 1 RE Reference Level 1 2 Reference Level 1 RE Reference Level 2 3 Reference Level 2 RE Reference Level 3 4 Reference level 3 RE Reference Level 4 NR Not Recommended RE Reference Level 4 4.4.1.
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