Engineering Specification
ES-3U5T-1B257-AA
EMC Design Guide for Printed Circuit Boards
Frame 50 of 78
Rev. A
10/01/2002
Printed copies are uncontrolled
4.4.4. Level 4
High EMC RE risk. Strict adherence to EMC fundamental design principles is
strongly recommended. Additional preventive measures, such as PCB shielding
(metal housing), harness and/or component shielding, extra layers, T-filters, Pi-
filters, ferrites, chokes, etc., may also be required at a substantial additional expense.
Supplier(s) choosing Level 4 IC(s) should keep in mind that in order to implement
and validate these additional preventive techniques an extra design time and/or test
time may be necessary.
4.4.5. Level NR
IC(s) classified as category NR may not be able, even with extra preventive
measures, to comply with Ford RE requirements and therefore should not be
considered. ESC(s) with NR category parts found to exceed Ford RE requirements
may be denied EMC approval.
4.5. Data Submission
It is recommended that suppliers request from IC manufacturers emissions plots (both
orientations) along with setup information (ref. SAE-J1752/3**, figure 4) for all
applicable integrated circuits prior to PCB layout. Such data should be available for
review by Ford EMC personnel upon request.
4.6. Radiated and Conducted Immunity
If the supplier is aware of any radiated or conducted immunity concerns which have the
potential of jeopardizing product robustness or timely delivery, Ford EMC representative
should be notified immediately.
Summary :
Engineering Specification ES-3U5T-1B257-AA EMC Design Guide for Printed Circuit Boards Frame 50 of 78 Rev. Radiated and Conducted Immunity If the supplier is aware of any radiated or conducted immunity concerns which have the potential of jeopardizing product robustness or timely delivery, Ford EMC representative should be notified immediately.
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