Engineering Specification
ES-3U5T-1B257-AA
EMC Design Guide for Printed Circuit Boards
Frame 73 of 78
Rev. A
10/01/2002
Printed copies are uncontrolled
7.5.
Which type of Ground distribution technique best describes the PCB?
Minimal (daisy chain)
g
f
e
d
c
Single-Point (star)
g
f
e
d
c
Multi-point
g
f
e
d
c
Hybrid
g
f
e
d
c
Ground grid
g
f
e
d
c
Ground plane
g
f
e
d
c
Other, explain: __________________________________________
g
f
e
d
c
7.6.
List all Power (voltage) levels present on PCB, and specify which ground they reference
Power Level
(Volts)
Reference Ground
(Example: 3.3 VDC)
(Example: Logic ground)
7.7.
List PCB layer stack-up and content, indicating the location of all crystal(s)/resonator(s)
Layer number
Layer content
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Summary :
Minimal (daisy chain) g f e d c Single-Point (star) g f e d c Multi-point g f e d c Hybrid g f e d c Ground grid g f e d c Ground plane g f e d c Other, explain: __________________________________________ g f e d c 7.6.
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