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THIN FILM CIRCUIT DESIGN GUIDELINE

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1.0 SCOPE

1.1

Purpose

This document defines the basic guidelines for designing substrates on alumina, aluminum

nitride, and duroid material.

1.2

Applicability

This document is applicable to all thin film ceramic substrates, as well as Duroid substrates
without plated through holes.

2.0

APPLICABLE

DOCUMENTS

2.1

Nanowave

Documents

QS6090001

Hybrid

MIC

Workmanship

Standard

SCD6094065

Specification Control Document for Raw Substrate Materials

2.2

Government

Documents

MIL-C-26074

Coating, Electroless Nickel, Requirements for

MIL-G-45204

Gold

Plating,

Electrode

Deposited

3.0

CERAMIC

SUBSTRATES

3.1

General Design Guide Summary

3.1.1 "Design Files" (Customer files). Autocad files (.dwg or .dxf) or GDSII files similar to

Fig.1 to be generated and submitted by the design engineer, to the drafting (CAD)
department for photomask layout. Use Table 1, 2 and 3 as guidelines to generate the
design file. These files shall have actual feature dimensions. Do not include any etch
factors to the drawing in this file. If etch factors are incorporated, state on the file what
etch factor was used. Critical dimensions, metalization schemes, material type, and
element values (resistors, capacitors) shall be stated in the drawing.

3.1.2 "Photomask layout". Autocad file (.dwg or .dxf) or GDSII file with alignment features,

step and repeat instructions, mask polarity, and etch factors incorporated. These files are
generated from the design file normally prepared by the draftspersons familiar with this
document prior to submitting to mask shop for fabrication.

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