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THIN FILM CIRCUIT DESIGN GUIDELINE

Document source : www.nanowavetech.com


Resistor Tolerance
+/-10% Standard. +/-1% laser trimmed.
Air Bridge:
U
Width
0.002" min.; 0.005" max.
W
Length between post
0.002" min.; 0.015" max
V
Contact Post size
0.0015" min. each side
S
Air bridge size at post
+0.0001" each side of contact post.
Crossover insulation
Si
3
N
4
dielectric 3000A ­ 3500A
T
Crossover overlap
+0.0001" over conductor
Bridge height/clearance
0.0004" norminal
Overlay Capacitor :
Dielectric
Si
3
N
4
3000 ­ 3500A°
Standard value (Tolerance +/-20%)
1.0 pF to 20pF
Max capacitor per circuit
80pF
Capacitance
density
230pF/mm
2
(0.15pF/mil
2
)
Breakdown voltage
25V (70V max)
TCC
70ppm/°C
Interconnect to other element
Air bridge
Top plate size A
Per capacitance area
Dielectric size
A+0.002" min. per side
Bottom plate size
A+0.002" min. per side
Dicing/ Cut out:
Dicing Tolerance
+/- 0.002" max.
Cut out Tolerance
+/- 0.002" max.
X
Cut out to circuit clearance
0.002" min.
Y
Cut out radius
0.004" min.
Cut out positioning
+/- 0.002"
Table 4. Process Guideline
Process Minimum
Geometry
achievable, mils
(Tolerance)
Etch Factor, mils
(2EF)
Applicable to design
Advantage
Conductor Patterning
Pattern Plate-up



Pattern Etch-back
1.0 line/ 0.4 space
(+/- 0.1)
(+/- 0.06)

2.0 line/ 0.8 space

0.0
-0.08

+0.4
Any. Except filled via.



Any. Except plated via.
Better geometry. Lower cost.



Faster to make. Substrate can be
pre-metalized.
Resistor Etch
Selective Etch



Etch from plated gold
2.0



2.0
0.0



-0.4
Any.



Any. Except plated via.
Better accuracy. Lower conductor
loss due to absence of resistive
film underneath.

Faster to make. Substrate can be
pre-metalized. Resistor width can
be maintained the same as the
conductor width.

Nanowave Confidential
Thin-film Guidelines/ Page 7 of 7







Summary :

Crossover insulation Si 3 N 4 dielectric 3000A ­ 3500A T Crossover overlap +0.0001" over conductor Bridge height/clearance 0.0004" norminal Overlay Capacitor : Dielectric Si 3 N 4 3000 ­ 3500A° Standard value (Tolerance +/-20%) 1.0 pF to 20pF Max capacitor per circuit 80pF Capacitance density 230pF/mm 2 (0.15pF/mil 2 ) Breakdown voltage 25V (70V max) TCC 70ppm/°C Interconnect to other element Air bridge Top plate size A Per capacitance area Dielectric size A+0.002" min.


Tags : min,max,0002,out,cut,tolerance,size,etch,conductor,bridge,post,any,side





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