3.3.4 Etch Factor (EF)
3.3.4 Etch Factor (EF)
(Note: If you are submitting a design file, do not add etch factor to the file.)
(Note: If you are submitting a design file, do not add etch factor to the file.)
1. Polished material .2 mils per edge.
1. Polished material .2 mils per edge.
2. Unpolished material .25 mils per edge.
2. Unpolished material .25 mils per edge.
3. When making a print labeled "with etch factor," be sure to indicate on the print what etch
factor was used.
3. When making a print labeled "with etch factor," be sure to indicate on the print what etch
factor was used.
3.3.5
Dimensional
Limits
3.3.5
Dimensional
Limits
Minimum
line
width
2.0
mils
Minimum
line
width
2.0
mils
Minimum gap width
.8 mils
Minimum gap width
.8 mils
Typical
tolerance
.2
mils
Typical
tolerance
.2
mils
Available
tolerance*
.1 mils
Available
tolerance*
.1 mils
*
Dimensional control of less than .2 mils requires extra care in mask procurement
and gold film thickness control. In general, it is more cost effective to use the
plate-up process for higher accuracy.
*
Dimensional control of less than .2 mils requires extra care in mask procurement
and gold film thickness control. In general, it is more cost effective to use the
plate-up process for higher accuracy.
3.3.6 Etch Back Mask Designs
3.3.6 Etch Back Mask Designs
Mask 1: Conductor Layer
Mask 1: Conductor Layer
Part
Mask
Space = 1.0
.6 = Space Space (Mask) = Space (Part) -.4
Line = 2.0
2.4 = Line
Line (Mask) = Line (Part) +.4
Example uses EF of .2 mils per side
Mask 2: Resistor Layer
Resistor site
Mask window
Width on mask
Conductor Conductor/ Resistor width (Width + .4mil)
Resistor length
Resistor window on mask (Resistor length 2EF)
Nanowave Confidential
Thin-film Guidelines/ Page 10 of 10