Use only material with sputtered gold flash for plate-up. See SCD6094065 for part number.
Use only material with sputtered gold flash for plate-up. See SCD6094065 for part number.
3.4.4 Etch
Factor
3.4.4 Etch
Factor
(Note: If you are submitting a design file, do not add the etch factor to the file.)
(Note: If you are submitting a design file, do not add the etch factor to the file.)
Conductor Layer Design (Required): 0.00 mils for non-critical geometry
Conductor Layer Design (Required): 0.00 mils for non-critical geometry
0.04 mils per edge for critical dimension
0.04 mils per edge for critical dimension
Resistor Window Etch: .2 mils per edge.
Resistor Window Etch: .2 mils per edge.
3.4.5 Dimensional Limits
3.4.5 Dimensional Limits
Minimum
line
width
1.0
mils
Minimum
line
width
1.0
mils
Minimum gap width
.4 mils
Minimum gap width
.4 mils
Typical
tolerance
.1
mils
Typical
tolerance
.1
mils
Available
tolerance*
.06
mils
Available
tolerance*
.06
mils
*
Dimensional control of less than .1 mil requires extra care in mask ordering
and inspection, and represents the limit of internal measurement accuracy.
*
Dimensional control of less than .1 mil requires extra care in mask ordering
and inspection, and represents the limit of internal measurement accuracy.
3.4.6 Plate-up Mask Design (with tight tolerance)
3.4.6 Plate-up Mask Design (with tight tolerance)
Mask 1: Conductor Layer Example :
Mask 1: Conductor Layer Example :
Part
Part: Mask:
Space=1.0 1.08=Space
Line=1.0 0.92=Line
Mask 2 : Resistor Layer
Resistor mask
Conductor Width
(After Plate-up)
Length
Resistor Window on mask
(Length 2EF)
Nanowave Confidential
Thin-film Guidelines/ Page 12 of 12