3.6 MHMIC
MHMIC circuit integrates most of the passive elements monolithically such as thin film resistors,
overlay capacitors, airbridges, spiral inductors, and via holes, on the same substrate. A complete
MHMIC patterning document consists of a laser drilling pattern and a set of five photomasks, the
conductor mask, resistor mask, capacitor dielectric mask, capacitor top plate (airbridge contact)
mask, and the airbridge mask. Chrome plated glass mask is preferred over emulsion mask for better
geometry clarity, durability and alignment accuracy.
3.6.1
CONDUCTOR MASK (M1)
3.6.1.1
Mask polarity:
Light field (conductor area is dark)
3.6.1.2
Photomask bias (etch factor): 0.0 mil
3.6.1.3
Minimum geometry: 1.0 mil line, 0.4 mil space
3.6.1.4
Conductor layout for resistor
Conductor (dark area
)
Resistor Length (L)
Fig. 5 Conductor design for selective resistor
3.6.1.5
Minimum pad size for wire bonding: 0.004" x 0.004"
3.6.1.6
Conductor patterns other than wrap-around via grounding pads should be minimum 2 mils
away from the cutting edges.
3.6.1.7
Alignment structure.
1
Via hole alignment (Fig. 6).
2
0.006" diameter dot should be placed at the middle of the dicing channel between the two
corner cross marks.
Nanowave Confidential
Thin-film Guidelines/ Page 15 of 15
Summary :
A complete MHMIC patterning document consists of a laser drilling pattern and a set of five photomasks, the conductor mask, resistor mask, capacitor dielectric mask, capacitor top plate (airbridge contact) mask, and the airbridge mask. 3.6.1 CONDUCTOR MASK (M1) 3.6.1.1 Mask polarity: Light field (conductor area is dark) 3.6.1.2 Photomask bias (etch factor): 0.0 mil 3.6.1.3 Minimum geometry: 1.0 mil line, 0.4 mil space 3.6.1.4 Conductor layout for resistor Conductor (dark area ) Resistor Length (L) Fig.
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