3.7
STEP & REPEAT
Step and repeat patterns are to be arranged over a 2"x2" area with 0.010" separation
between (or unit cell) for dicing (dicing channel). In the case of hole sharing design
between circuits, step and repeat patterns shall be arranged as described in Fig. 4.
x
x
y
y
Unit cell
Unit cell
x
10 mil dicing channel
y
10 mil
0.100" min. from edge
0.100"
min.
Unit cell
Fig. 14 Step and repeat
4.0
DUROID SUBSTRATES
4.1
Material
Standards
The duroid material used to make substrates comes in many dielectric values, material types,
and copper thicknesses. Refer to SCD6094065 for part numbers of the common types.
The duroid material is processed using positive film masks, positive photoresist, and etch-
back patterning. The resulting pattern is trimmed to size by assembly personnel or the
machine shop. The etch and plating labs within our plant do offer gold plated duroid
substrates. There is a restriction to be aware of, this is listed in the design guidelines section
(see Section 4.2, Rule 7). After the pattern is etched into the copper, the substrates are then
nickel and gold plated. This does yield a bondable substrate with excellent solderability.
4.2
Design
Rules
1. The substrate outside dimensions should be toleranced to ±5 mils
2. Any line, pad, or gap should have minimum length and width of 5 mils. Consult the etch
lab if a width smaller than 5 mils is desired (before the etch factor).
3. The substrate pattern should be 6 mils from any edge to be cut.
Nanowave Confidential
Thin-film Guidelines/ Page 21 of 21
Summary :
x x y y Unit cell Unit cell x 10 mil dicing channel y 10 mil 0.100" min. 14 Step and repeat 4.0 DUROID SUBSTRATES 4.1 Material Standards The duroid material used to make substrates comes in many dielectric values, material types, and copper thicknesses.
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