199
Varistor Products
©2009 Littelfuse, Inc.
Revision: November 5, 2009
RA Varistor Series
Low Profile / Application Specific Varistors > RA Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/ra.html for current information.
RA S
eries
Reflow Condition
Pb Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 180 secs
Average rampup rate (Liquidus Temp (TL)
to peak
5°C/second max
TS(max) to TL - Ramp-up Rate
5°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 150 seconds
Peak Temperature (TP)
250+0/-5°C
Time within 5°C of actual peak
Temperature (tp)
20 40 seconds
Ramp-down Rate
5°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
0
50
100
150
200
250
300
0
0.5
1
1.5
2
2.5
3
3.5
4
TIME(MINUTES)
T
EMPER
A
T
U
R
E
(º
C
)
Maximum Wave 240C
Leadfree Profile
0
50
100
150
200
250
300
0
0.5
1
1.5
2
2.5
3
3.5
4
TIME(MINUTES)
T
EMPER
A
T
U
R
E
(º
C
)
Maximum Wave 260C
Non Leadfree Profile
Wave Solder Profile
Operating/Storage
Temperature
-55°C to +125°C / -55°C to +150°C
Humidity Aging
+85°C, 85% RH, 1000 hours
+/-10% Voltage
Thermal Shock
+85°C to -40°C 10 times
+/-10% Voltage
Solvent Resistance
MILSTD202, Method 215F
Moisture Sensitivity
Level 1, JSTD020C
Lead Material
TinCoated Copper
Soldering
Characteristics
Solderability per MILSTD202,
Method 208E
Insulating Material
Cured, flame retardant epoxy polymer
meets UL94V0 requirements.
Device Labeling
Marked with LF, voltage, amperage rating,
and date code.
Physical Specifications
Environmental Specifications
Figure 16
Figure 17