Figure 3.7:
Equivalent circuit model used to derive the impedance and velocity variations
for odd- and even-mode switching patterns.
Figure 3.8:
Simplified circuit for determining the equivalent odd-mode inductance.
Figure 3.9:
Simplified circuit for determining the equivalent odd mode capacitance.
Figure 3.10:
Odd- and even-mode electric and magnetic field patterns for a simple two-
conductor system.
Figure 3.11:
Effect of switching patterns on a three-conductor system.
Figure 3.12:
Example switching pattern: (a) all bits switching in phase; (b) bits 1 and 2
switching in phase, bit 3 switching 180° out of phase.
Figure 3.13:
Variations in impedance as a function of spacing: (a) typical stripline two
conductor system; (b) typical microstrip two-conductor system.
Figure 3.14:
Mutual inductance and capacitance for (a) stripline in Figure 3.13a and (b)
microstrip in Figure 3.13b.
Figure 3.15:
Pi termination configuration for a coupled transmission line pair.
Figure 3.16:
Equivalent of termination seen in the odd mode with the pi termination
configuration.
Figure 3.17:
T termination configuration for a coupled transmission line pair.
Figure 3.18:
Equivalent of termination seen in the even mode with the T termination
configuration.
Figure 3.19:
Dimensions that influence crosstalk.
Figure 3.20:
Cross section of PCB board used in the example.
Figure 3.21:
Circuit topology.
Figure 3.22:
Common-mode switching pattern.
Figure 3.23:
Differential switching pattern.
Figure 3.24:
Calculation of the final waveform.
Chapter 4:
Nonideal Interconnect Issues
Figure 4.1:
Microstrip line current density at dc. At dc, current flows through entire area
of the cross section where area = A = Wt.
Figure 4.2:
Current distribution on a microstrip transmission line. 63% of the current is
concentrated in the darkly shaded area due to the skin effect.
Figure 4.3:
Skin depth as a function of frequency.
Figure 4.4:
Ac resistance as a function of frequency.
Figure 4.5:
Current density distribution in the ground plane.